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Advanced Millimeter-Wave Technologies: Antennas, Packaging and Circuits
Contributor(s): Liu, Duixian (Editor), Pfeiffer, Ulrich (Editor), Grzyb, Janusz (Editor)
ISBN: 047099617X     ISBN-13: 9780470996171
Publisher: John Wiley & Sons
OUR PRICE:   $199.45  
Product Type: Hardcover - Other Formats
Published: April 2009
Qty:
Annotation: This book explains one of the hottest topics in wireless and electronic devices community, namely the wireless communication at mmWave frequencies, especially at the 60 GHz ISM band. It provides the reader with knowledge and techniques for mmWave antenna design, evaluation, antenna and chip packaging. Addresses practical engineering issues such as RF material evaluation and selection, antenna and packaging requirements, manufacturing tolerances, antenna and system interconnections, and antenna One of the first books to discuss the emerging research and application areas, particularly chip packages with integrated antennas, wafer scale mmWave phased arrays and imaging Contains a good number of case studies to aid understanding Provides the antenna and packaging technologies for the latest and emerging applications with the emphases on antenna integrations for practical applications such as wireless USB, wireless video, phase array, automobile collision avoidance radar, and imaging
Additional Information
BISAC Categories:
- Technology & Engineering | Electronics - General
Dewey: 621.381
LCCN: 2008041821
Physical Information: 2" H x 6.83" W x 9.85" (3.39 lbs) 864 pages
 
Descriptions, Reviews, Etc.
Publisher Description:
This book explains one of the hottest topics in wireless and electronic devices community, namely the wireless communication at mmWave frequencies, especially at the 60 GHz ISM band. It provides the reader with knowledge and techniques for mmWave antenna design, evaluation, antenna and chip packaging.
  • Addresses practical engineering issues such as RF material evaluation and selection, antenna and packaging requirements, manufacturing tolerances, antenna and system interconnections, and antenna
  • One of the first books to discuss the emerging research and application areas, particularly chip packages with integrated antennas, wafer scale mmWave phased arrays and imaging
  • Contains a good number of case studies to aid understanding
  • Provides the antenna and packaging technologies for the latest and emerging applications with the emphases on antenna integrations for practical applications such as wireless USB, wireless video, phase array, automobile collision avoidance radar, and imaging