| Advances in Deformation Processing Softcover Repri Edition Contributor(s): Burke, John J. (Author), Weiss, Volker (Author) |
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ISBN: 1461340268 ISBN-13: 9781461340263 Publisher: Springer OUR PRICE: $104.49 Product Type: Paperback - Other Formats Published: December 2012 |
| Additional Information |
| BISAC Categories: - Technology & Engineering | Technical & Manufacturing Industries & Trades - Science | Physics - General |
| Dewey: 671.3 |
| Series: Sagamore Army Materials Research Conference Proceedings |
| Physical Information: 1.24" H x 6.69" W x 9.61" (2.12 lbs) 596 pages |
| Descriptions, Reviews, Etc. |
| Publisher Description: The Army Materials and Mechanics Research Center has con- ducted the Sagamore Army Materials Research Conference in coop- eration with the Materials Science Group of the Department of Chemical Engineering and Materials Science of Syracuse University since 1954. The purpose of the conference has been to gather to- gether scientists and engineers from academic institutions, in- dustry and government who are uniquely qualified to explore in depth a subject of importance to the Army, the Department of Defense and the scientific community. This volume, Advances in Deformation Processing, addresses the areas of Analytical Advances, Workability, Processing to Optimize Properties, Advanced Applications - Materials, and Advanced Applications - Processes. The dedicated assistance of Mr. Joseph Bernier of the Army Materials and Mechanics Research Center throughout the stages of the conference planning and finally the publication of the Sagamore Conference Proceedings is deeply appreciated. The support of Helen Brown DeMascio of Syracuse University in p- paring the final manuscript is acknowledged. The continued active interest and support of these conferences by Dr. A. E. Gorum, Director of the Army Materials and Mechanics Research Center, is appreciated. Syracuse University Syracuse, New York The Editors vii Contents SESSION I INTRODUCTION A. E. Gorum, Moderator Continuum Mechanics and Deformation Processing 1. |