| Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging Contributor(s): Lee, Jong-Hoon (Author) |
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ISBN: 1598292447 ISBN-13: 9781598292442 Publisher: Morgan & Claypool OUR PRICE: $38.00 Product Type: Paperback Published: November 2007 * Not available - Not in print at this time *Annotation: This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCe V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. |
| Additional Information |
| BISAC Categories: - Science | Physics - Mathematical & Computational - Technology & Engineering | Electronics - General - Technology & Engineering | Engineering (general) |
| Dewey: 621.381 |
| Series: Synthesis Lectures on Computational Electromagnetics |
| Physical Information: 0.24" H x 7.5" W x 9.25" (0.47 lbs) 108 pages |
| Descriptions, Reviews, Etc. |
| Publisher Description: This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. |