| 3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization 2022 Edition Contributor(s): Bamberg, Lennart (Author), Joseph, Jan Moritz (Author), García-Ortiz, Alberto (Author) |
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ISBN: 3030982319 ISBN-13: 9783030982317 Publisher: Springer OUR PRICE: $123.49 Product Type: Paperback Published: June 2023 |
| Additional Information |
| BISAC Categories: - Technology & Engineering | Electronics - Circuits - General - Computers | Systems Architecture - General - Computers | Embedded Computer Systems |
| Physical Information: 0.86" H x 6.14" W x 9.21" (1.30 lbs) 395 pages |