| 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems Softcover Repri Edition Contributor(s): Elfadel (Editor), Fettweis, Gerhard (Editor) |
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ISBN: 3319793055 ISBN-13: 9783319793054 Publisher: Springer OUR PRICE: $52.24 Product Type: Paperback - Other Formats Published: May 2018 |
| Additional Information |
| BISAC Categories: - Technology & Engineering | Electronics - Circuits - General - Computers | Systems Architecture - General - Computers | Hardware - Mainframes & Minicomputers |
| Dewey: 004.1 |
| Physical Information: 0.75" H x 6.14" W x 9.21" (1.12 lbs) 339 pages |
| Descriptions, Reviews, Etc. |
| Publisher Description: This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems. |