| Advances in 3D Integrated Circuits and Systems Contributor(s): Yu, Hao (Author), Tan, Chuan Seng (Author) |
|
 |
ISBN: 9814699004 ISBN-13: 9789814699006 Publisher: World Scientific Publishing Company OUR PRICE: $133.95 Product Type: Hardcover - Other Formats Published: October 2015 |
| Additional Information |
| BISAC Categories: - Technology & Engineering | Electronics - Circuits - Integrated - Technology & Engineering | Electronics - Circuits - Logic |
| Dewey: 621.381 |
| LCCN: 2015020144 |
| Series: Emerging Technologies in Circuits and Systems |
| Physical Information: 0.9" H x 6" W x 8.9" (1.25 lbs) 392 pages |
| Descriptions, Reviews, Etc. |
| Publisher Description:
3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs. Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory. Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems. |