3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5g Mobility Contributor(s): Hwang, Lih-Tyng (Author), Horng, Tzyy-Sheng Jason (Author) |
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ISBN: 1119289645 ISBN-13: 9781119289647 Publisher: Wiley-IEEE Press OUR PRICE: $220.40 Product Type: Hardcover - Other Formats Published: July 2018 |
Additional Information |
BISAC Categories: - Computers | Logic Design - Technology & Engineering | Mobile & Wireless Communications |
Dewey: 621.395 |
LCCN: 2017052146 |
Series: Wiley - IEEE |
Physical Information: 464 pages |
Descriptions, Reviews, Etc. |
Publisher Description: An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments
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