Limit this search to....

3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5g Mobility
Contributor(s): Hwang, Lih-Tyng (Author), Horng, Tzyy-Sheng Jason (Author)
ISBN: 1119289645     ISBN-13: 9781119289647
Publisher: Wiley-IEEE Press
OUR PRICE:   $220.40  
Product Type: Hardcover - Other Formats
Published: July 2018
Qty:
Temporarily out of stock - Will ship within 2 to 5 weeks
Additional Information
BISAC Categories:
- Computers | Logic Design
- Technology & Engineering | Mobile & Wireless Communications
Dewey: 621.395
LCCN: 2017052146
Series: Wiley - IEEE
Physical Information: 464 pages
 
Descriptions, Reviews, Etc.
Publisher Description:

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments

  • Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility
  • Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab
  • Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
  • Provides chapter-wise review questions and powerpoint slides as teaching tools