| 3D Microelectronic Packaging: From Fundamentals to Applications Softcover Repri Edition Contributor(s): Li, Yan (Editor), Goyal, Deepak (Editor) |
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ISBN: 3319830864 ISBN-13: 9783319830865 Publisher: Springer OUR PRICE: $189.99 Product Type: Paperback - Other Formats Published: July 2018 |
| Additional Information |
| BISAC Categories: - Technology & Engineering | Electronics - Circuits - General - Technology & Engineering | Materials Science - Electronic Materials - Science | Biotechnology |
| Dewey: 620.112 |
| Series: Springer Series in Advanced Microelectronics |
| Physical Information: 0.96" H x 6.14" W x 9.21" (1.46 lbs) 463 pages |
| Descriptions, Reviews, Etc. |
| Publisher Description: This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development. |