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Title Author / Artist Prod Type ISBN/ISBN-13
or UPC		 Pub
Date		 Price
3D Microelectronic Packaging: From Architectures to Applications 2021 Edition Li, YanPaperback9811570922 /
9789811570926		11/2021$189.99
3D Microelectronic Packaging: From Fundamentals to Applications Softcover Repri Edition (Springer Series in Advanced Microelectronics)Li, YanPaperback3319830864 /
9783319830865		07/2018$189.99
  (2 items found)