| 3D Microelectronic Packaging: From Architectures to Applications 2021 Edition Contributor(s): Li, Yan (Editor), Goyal, Deepak (Editor) |
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ISBN: 9811570922 ISBN-13: 9789811570926 Publisher: Springer OUR PRICE: $189.99 Product Type: Paperback - Other Formats Published: November 2021 |
| Additional Information |
| BISAC Categories: - Technology & Engineering | Electronics - Circuits - General - Technology & Engineering | Materials Science - Electronic Materials - Technology & Engineering | Materials Science - Metals & Alloys |
| Dewey: 620.112 |
| Physical Information: 1.29" H x 6.14" W x 9.21" (1.95 lbs) 622 pages |