| Wear of Materials: 14th International Conference Contributor(s): Blau, Peter J. (Author), Bayer, R. G. (Editor) |
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ISBN: 008044301X ISBN-13: 9780080443010 Publisher: Elsevier Science OUR PRICE: $774.25 Product Type: Hardcover Published: October 2003 Annotation: The 14th International Conference on Wear of Materials took place in Washington, DC, USA, 30 March - 3 April 2003. These proceedings contain over two-hundred peer reviewed papers containing the best research, technical developments and engineering case studies from around the world. Biomaterials and nano-tribology receive special attention in this collection reflecting the general trends in the field. Further highlights include a focus on the new generation of instrumentation to probe wear at increasingly small scales. Approximately ninety communications and case studies, a popular format for the academic community have also been included, enabling the inclusion of the most up-to-date research. *Over 200 peer-reviewed papers including hot topics such as biomaterials and nano-tribology *Keeping you up-to-date with the latest research from leading experts *Includes communications and case studies |
| Additional Information |
| BISAC Categories: - Science | Nanoscience - Technology & Engineering | Tribology - Technology & Engineering | Materials Science - General |
| Dewey: 620.112 |
| LCCN: 2004295059 |
| Physical Information: 1800 pages |
| Descriptions, Reviews, Etc. |
| Publisher Description: The 14th International Conference on Wear of Materials took place in Washington, DC, USA, 30 March - 3 April 2003. These proceedings contain over two-hundred peer reviewed papers containing the best research, technical developments and engineering case studies from around the world. Biomaterials and nano-tribology receive special attention in this collection reflecting the general trends in the field. Further highlights include a focus on the new generation of instrumentation to probe wear at increasingly small scales. Approximately ninety communications and case studies, a popular format for the academic community have also been included, enabling the inclusion of the most up-to-date research. |