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Design for Thermal Stresses
Contributor(s): Barron, Randall F. (Author), Barron, Brian R. (Author)
ISBN: 0470627697     ISBN-13: 9780470627693
Publisher: Wiley
OUR PRICE:   $170.95  
Product Type: Hardcover - Other Formats
Published: October 2011
Qty:
Temporarily out of stock - Will ship within 2 to 5 weeks
Additional Information
BISAC Categories:
- Science | Mechanics - Thermodynamics
- Science | Nanoscience
Dewey: 620.112
LCCN: 2011024789
Physical Information: 1.3" H x 6.2" W x 9.3" (1.85 lbs) 528 pages
 
Descriptions, Reviews, Etc.
Publisher Description:

The tools engineers need for effective thermal stress design

Thermal stress concerns arise in many engineering situations, from aerospace structures to nuclear fuel rods to concrete highway slabs on a hot summer day. Having the tools to understand and alleviate these potential stresses is key for engineers in effectively executing a wide range of modern design tasks.

Design for Thermal Stresses provides an accessible and balanced resource geared towards real-world applications. Presenting both the analysis and synthesis needed for accurate design, the book emphasizes key principles, techniques, and approaches for solving thermal stress problems. Moving from basic to advanced topics, chapters cover:

  • Bars, beams, and trusses from a "strength of materials" perspective

  • Plates, shells, and thick-walled vessels from a "theory of elasticity" perspective

  • Thermal buckling in columns, beams, plates, and shells

Written for students and working engineers, this book features numerous sample problems demonstrating concepts at work. In addition, appendices include important SI units, relevant material properties, and mathematical functions such as Bessel and Kelvin functions, as well as characteristics of matrices and determinants required for designing plates and shells. Suitable as either a working reference or an upper-level academic text, Design for Thermal Stresses gives students and professional engineers the information they need to meet today's thermal stress design challenges.