| Advanced Interconnects for ULSI Technology Contributor(s): Baklanov, Mikhail (Editor), Ho, Paul S. (Editor), Zschech, Ehrenfried (Editor) |
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ISBN: 0470662549 ISBN-13: 9780470662540 Publisher: Wiley OUR PRICE: $233.65 Product Type: Hardcover - Other Formats Published: April 2012 |
| Additional Information |
| BISAC Categories: - Technology & Engineering | Electronics - Circuits - Vlsi & Ulsi - Computers | Logic Design |
| Dewey: 621.395 |
| LCCN: 2011038787 |
| Physical Information: 1.3" H x 6.9" W x 9.8" (2.20 lbs) 608 pages |
| Descriptions, Reviews, Etc. |
| Publisher Description: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: *Interconnect functions, characterisations, electrical properties and wiring requirements *Low-k materials: fundamentals, advances and mechanical properties *Conductive layers and barriers *Integration and reliability including mechanical reliability, electromigration and electrical breakdown *New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips. |