| Advances in Thermal Modeling of Electronic Components and Systems, Volume 4 Contributor(s): Cohen, Avram Bar (Editor), Kraus, Allan D. (Editor) |
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ISBN: 0791800652 ISBN-13: 9780791800652 Publisher: American Society of Mechanical Engineers OUR PRICE: $103.55 Product Type: Hardcover - Other Formats Published: January 1998 |
| Additional Information |
| BISAC Categories: - Technology & Engineering | Electrical - Technology & Engineering | Electronics - General |
| Dewey: 621.381 |
| Series: Advances in Thermal Modeling of Electronic Components and Systems |
| Physical Information: 1.2" H x 6.3" W x 9.2" (1.75 lbs) 459 pages |
| Descriptions, Reviews, Etc. |
| Publisher Description: This volume of the series focuses on air cooling technology. Begins with a review of techniques used in thermal analysis of natural convection electronic systems, and continues with the presentation of a methodology for thermal modeling of air cooled components mounted on printed circuit boards. Gov |