| Thermal Management of Microelectronic Equipment Contributor(s): Yeh, L. -T (Author), ASME Press (Author), Chu, R. C. (Author) |
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ISBN: 0791801683 ISBN-13: 9780791801680 Publisher: American Society of Mechanical Engineers OUR PRICE: $99.75 Product Type: Hardcover Published: January 2002 |
| Additional Information |
| BISAC Categories: - Technology & Engineering | Electronics - General |
| Dewey: 621.381 |
| LCCN: 2001034086 |
| Series: Asme Press Book Series on Electronic Packaging |
| Physical Information: 1.16" H x 6.39" W x 9.38" (1.75 lbs) 414 pages |
| Descriptions, Reviews, Etc. |
| Publisher Description: Veteran researchers Yeh and Chu (both have worked in the field for decades and published extensively) describe the factors behind the thermal performance of electronics and provide details on the wide range of subjects and solutions necessary for different applications. The physics of heat transfer |