| Benefiting from Thermal and Mechanical Simulation in Micro-Electronics 2000 Edition Contributor(s): Zhang, G. Q. (Editor), Ernst, L. J. (Editor), De Saint Leger, O. (Editor) |
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ISBN: 0792372786 ISBN-13: 9780792372783 Publisher: Springer OUR PRICE: $104.49 Product Type: Hardcover - Other Formats Published: December 2000 Annotation: Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are: - The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation ??/LIST?? Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics. |
| Additional Information |
| BISAC Categories: - Technology & Engineering | Electronics - Microelectronics - Technology & Engineering | Electrical - Technology & Engineering | Manufacturing |
| Dewey: 621.381 |
| LCCN: 00067430 |
| Physical Information: 0.56" H x 7.06" W x 9.14" (1.10 lbs) 192 pages |
| Descriptions, Reviews, Etc. |
| Publisher Description: Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are: - |
