Antenna-in-Package Technology and Applications Contributor(s): Liu, Duixian (Author) |
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ISBN: 1119556635 ISBN-13: 9781119556633 Publisher: Wiley-IEEE Press OUR PRICE: $133.90 Product Type: Hardcover - Other Formats Published: March 2020 |
Additional Information |
BISAC Categories: - Technology & Engineering | Mobile & Wireless Communications - Technology & Engineering | Telecommunications |
Dewey: 621.382 |
LCCN: 2019057782 |
Series: Wiley - IEEE |
Physical Information: 0.9" H x 6" W x 9.1" (1.65 lbs) 416 pages |
Descriptions, Reviews, Etc. |
Publisher Description: A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors--well-known experts on the topic--explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging-based AiP, and 3D-printing-based AiP. - Includes a brief history of antenna-in-package technology Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging. |