| Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces Contributor(s): Keser, Beth (Author) |
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ISBN: 1119793777 ISBN-13: 9781119793779 Publisher: Wiley-IEEE Press OUR PRICE: $143.40 Product Type: Hardcover - Other Formats Published: December 2021 |
| Additional Information |
| BISAC Categories: - Technology & Engineering | Electronics - Microelectronics - Technology & Engineering | Electronics - Semiconductors - Technology & Engineering | Industrial Design - Packaging |
| Physical Information: 0.75" H x 6" W x 9" (1.30 lbs) 320 pages |