| RF and Microwave Microelectronics Packaging 2010 Edition Contributor(s): Kuang, Ken (Editor), Kim, Franklin (Editor), Cahill, Sean S. (Editor) |
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ISBN: 1441909834 ISBN-13: 9781441909831 Publisher: Springer OUR PRICE: $161.49 Product Type: Hardcover - Other Formats Published: November 2009 Annotation: RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. |
| Additional Information |
| BISAC Categories: - Technology & Engineering | Electronics - Microelectronics - Technology & Engineering | Electronics - Circuits - General - Technology & Engineering | Microwaves |
| Dewey: 621.381 |
| LCCN: 2009939146 |
| Physical Information: 0.69" H x 6.14" W x 9.21" (1.33 lbs) 285 pages |
| Descriptions, Reviews, Etc. |
| Publisher Description: RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. |
