| Solder Joint Technology: Materials, Properties, and Reliability Contributor(s): Tu, King-Ning (Author) |
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ISBN: 1441922849 ISBN-13: 9781441922847 Publisher: Springer OUR PRICE: $237.49 Product Type: Paperback - Other Formats Published: November 2010 |
| Additional Information |
| BISAC Categories: - Technology & Engineering | Metallurgy - Technology & Engineering | Materials Science - Metals & Alloys - Technology & Engineering | Electrical |
| Dewey: 671.56 |
| Series: Springer Materials Science |
| Physical Information: 0.8" H x 6.14" W x 9.21" (1.19 lbs) 370 pages |
| Descriptions, Reviews, Etc. |
| Publisher Description: Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed. |