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Bond Graph Modelling of Engineering Systems: Theory, Applications and Software Support 2011 Edition
Contributor(s): Borutzky, Wolfgang (Editor)
ISBN: 1441993673     ISBN-13: 9781441993670
Publisher: Springer
OUR PRICE:   $189.99  
Product Type: Hardcover - Other Formats
Published: June 2011
Qty:
Additional Information
BISAC Categories:
- Technology & Engineering | Automation
- Mathematics | Applied
- Technology & Engineering | Mechanical
Dewey: 519
LCCN: 2011927919
Physical Information: 1" H x 6.1" W x 9.2" (1.80 lbs) 435 pages
 
Descriptions, Reviews, Etc.
Publisher Description:
The author presents current work in bond graph methodology by providing a compilation of contributions from experts across the world that covers theoretical topics, applications in various areas as well as software for bond graph modeling.

It addresses readers in academia and in industry concerned with the analysis of multidisciplinary engineering systems or control system design who are interested to see how latest developments in bond graph methodology with regard to theory and applications can serve their needs in their engineering fields.

This presentation of advanced work in bond graph modeling presents the leading edge of research in this field. It is hoped that it stimulates new ideas with regard to further progress in theory and in applications.