| Thermal Conductivity 20 Softcover Repri Edition Contributor(s): Thomas, J. R. Jr. (Author), Hasselman, D. P. H. (Author) |
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ISBN: 1461280699 ISBN-13: 9781461280699 Publisher: Springer OUR PRICE: $52.24 Product Type: Paperback - Other Formats Published: September 2011 |
| Additional Information |
| BISAC Categories: - Science | Nanoscience - Technology & Engineering | Materials Science - General |
| Dewey: 620.112 |
| Physical Information: 0.92" H x 6.69" W x 9.61" (1.59 lbs) 440 pages |
| Descriptions, Reviews, Etc. |
| Publisher Description: The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks and grew out of the needs of researchers in the field. The Conferences were held annually from 1961 to 1973 and have been held biennially since 1975 when our Center for Informa- tion and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences. -These Conferences provide a broadly based forum for researchers actively working on the thermal con- ductivity and closely related properties to convene on a regular basis to exchange their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible. arti- ficial barriers between disciplines and gather together in increasing num- bers without the need of national publicity and continuing funding support. when they see something worthwhile going on. It is believed that this ser- ies of Conferences not only will grow stronger. but will set an example for researchers in other fields on how to jointly attack their own problem areas. |