| Through Silicon Vias: Materials, Models, Design, and Performance Contributor(s): Kaushik, Brajesh Kumar (Author), Ramesh Kumar, Vobulapuram (Author), Majumder, Manoj Kumar (Author) |
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ISBN: 1498745520 ISBN-13: 9781498745529 Publisher: CRC Press OUR PRICE: $237.50 Product Type: Hardcover - Other Formats Published: August 2016 |
| Additional Information |
| BISAC Categories: - Science | Physics - General - Technology & Engineering | Electronics - Microelectronics - Computers | Logic Design |
| Dewey: 621.395 |
| LCCN: 2016009688 |
| Physical Information: 216 pages |
| Descriptions, Reviews, Etc. |
| Publisher Description: Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed. |