| Advanced Metallization Conference in 1998 (AMC 1998): Volume 14 Contributor(s): Sandhu, Gurtej S. (Editor), Koerner, Heinrich (Editor), Murakami, Masanori (Editor) |
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ISBN: 155899484X ISBN-13: 9781558994843 Publisher: Materials Research Society OUR PRICE: $29.44 Product Type: Hardcover Published: February 2000 |
| Additional Information |
| BISAC Categories: - Technology & Engineering | Materials Science - General - Technology & Engineering | Electronics - Circuits - Integrated |
| Dewey: 621.381 |
| LCCN: 99201698 |
| Series: Materials Research Society Conference Proceedings |
| Physical Information: 1.8" H x 6.5" W x 9.3" (2.60 lbs) 784 pages |
| Descriptions, Reviews, Etc. |
| Publisher Description: This volume, the newest in a series dedicated to leading-edge research for advanced metallization in integrated circuit applications, represents an industry milestone by switching to Cu-based metallization. The conference, which originated as Tungsten Workshop in the early 1980s, was later changed to Advanced Metallization and Interconnect Systems for ULSI Applications. It has now been renamed once again, this time to Advanced Metallization Conference (AMC), in order to better represent its expanded scope. The volume features two keynote addresses -- one on "Shift to Copper and Low-k at SEMATECH", the other on "ULSI Scaling and Interconnect Technology". |