| RF Measurements of Die and Packages Contributor(s): Wartenberg, Scott A. (Author) |
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ISBN: 158053273X ISBN-13: 9781580532730 Publisher: Artech House Publishers OUR PRICE: $119.70 Product Type: Hardcover Published: May 2002 Annotation: The explosion in the wireless industry, coupled with the higher frequencies in today's digital integrated circuits (IC) has made vital the need for accurate IC testing. This is the first book dedicated to the issues surrounding RFIC testing. This ground breaking work enables professionals to perform high-accuracy RF measurements of die and packages in the RF test lab. This timely volume defines the essential elements in an RF system, explains where errors can be found in such a system and shows how to mathematically remove them with calibration. |
| Additional Information |
| BISAC Categories: - Technology & Engineering | Electronics - Circuits - General - Technology & Engineering | Electrical - Technology & Engineering | Telecommunications |
| Dewey: 621.381 |
| LCCN: 2002016431 |
| Series: Artech House Microwave Library (Hardcover) |
| Physical Information: 0.85" H x 6.36" W x 9.26" (1.13 lbs) 244 pages |
| Descriptions, Reviews, Etc. |
| Publisher Description: This text is dedicated to the issues surrounding RFIC (radio-frequency integrated circuit) testing. It explains how to perform high-accuracy RF measurements of die and packages in the RF test lab. It defines the essential elements in an RF system, explains where errors can be found in such a system and shows how to mathematically remove them with calibration. |