Silver Metallization: Stability and Reliability 2008 Edition Contributor(s): Adams, Daniel (Author), Alford, Terry L. (Author), Mayer, James W. (Author) |
|
ISBN: 184800026X ISBN-13: 9781848000261 Publisher: Springer OUR PRICE: $104.49 Product Type: Hardcover - Other Formats Published: October 2007 |
Additional Information |
BISAC Categories: - Technology & Engineering | Metallurgy - Technology & Engineering | Materials Science - Metals & Alloys - Technology & Engineering | Electronics - Circuits - Integrated |
Dewey: 621.381 |
LCCN: 2007932625 |
Series: Engineering Materials and Processes |
Physical Information: 0.5" H x 6.2" W x 9.4" (0.70 lbs) 123 pages |
Descriptions, Reviews, Etc. |
Publisher Description: Here is the first book to discuss the current understanding of silver metallization and its potential as a future interconnect material for integrated circuit technology. With the lowest resistivity of all metals, silver is an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the issues that have prevented silver from being used as an interconnect metal. The authors provide details on a wide range of experimental, characterization, and analysis techniques. The book is written for students, scientists, engineers, and technologists in the fields of integrated circuits and microelectronics research and development. |