| Materials for Information Technology: Devices, Interconnects and Packaging Contributor(s): Zschech, Ehrenfried (Editor), Whelan, Caroline (Editor), Mikolajick, Thomas (Editor) |
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ISBN: 1849969671 ISBN-13: 9781849969673 Publisher: Springer OUR PRICE: $208.05 Product Type: Paperback - Other Formats Published: October 2010 |
| Additional Information |
| BISAC Categories: - Technology & Engineering | Metallurgy - Technology & Engineering | Materials Science - Ceramics - Technology & Engineering | Electrical |
| Dewey: 621.381 |
| Series: Engineering Materials and Processes |
| Physical Information: 1.07" H x 6.14" W x 9.21" (1.62 lbs) 508 pages |
| Descriptions, Reviews, Etc. |
| Publisher Description: This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries. |