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Materials for Information Technology: Devices, Interconnects and Packaging 2005 Edition
Contributor(s): Zschech, Ehrenfried (Editor), Whelan, Caroline (Editor), Mikolajick, Thomas (Editor)
ISBN: 1852339411     ISBN-13: 9781852339418
Publisher: Springer
OUR PRICE:   $208.99  
Product Type: Hardcover - Other Formats
Published: September 2005
Qty:
Annotation: The fast-developing information technology industry is driving a need for new materials in order to facilitate the development of more reliable microelectronic products.

Materials for Information Technology is an up-to-date overview of current developments and R&D activities in the field of materials used for information technology with a focus on future applications. Included are:

  • materials for silicon-based semiconductor devices (including high-k gate dielectric materials);
  • materials for nonvolatile memories;
  • materials for on-chip interconnects and interlayer dielectrics (including silicides, barrier materials, low-k and ultra low-k dielectric materials); and
  • materials for assembly and packaging

The latest results in materials science and engineering as well as applications in the semiconductor industry are covered including the synthesis of blanket and patterned thin film materials, their properties, constitution, structure and microstructure. Computer modelling and analytical techniques to characterise thin film structures are also included to give a comprehensive survey of materials for the IT industry.
Additional Information
BISAC Categories:
- Technology & Engineering | Metallurgy
- Technology & Engineering | Materials Science - Ceramics
- Technology & Engineering | Electrical
Dewey: 621.381
LCCN: 2005924304
Series: Engineering Materials and Processes
Physical Information: 1.13" H x 6.14" W x 9.21" (2.02 lbs) 508 pages
 
Descriptions, Reviews, Etc.
Publisher Description:

This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.