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Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6: Proceedings of the 2019 Annual Conference on Experimental and Appl 2020 Edition
Contributor(s): Baldi, Antonio (Editor), Kramer, Sharlotte L. B. (Editor), Pierron, Fabrice (Editor)
ISBN: 3030301001     ISBN-13: 9783030301002
Publisher: Springer
OUR PRICE:   $161.49  
Product Type: Paperback - Other Formats
Published: August 2021
Qty:
Additional Information
BISAC Categories:
- Science | Mechanics - Solids
- Technology & Engineering | Engineering (general)
- Technology & Engineering | Materials Science - General
Dewey: 531
Physical Information: 0.38" H x 8.25" W x 11" (0.92 lbs) 169 pages
 
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Publisher Description:

Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6 of the Proceedings of the 2019 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the sixth volume of six from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including:

Test Design and Inverse Method Algorithms

Inverse Problems: Virtual Fields Method

Residual Stresses: Measurement, Uncertainty & Validation

Residual Stresses: Eigenvalues, Modeling, & Crack Growth

Material Characterizations Using Thermography

Fatigue, Damage & Fracture Evaluation Using Infrared Thermography