Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6: Proceedings of the 2019 Annual Conference on Experimental and Appl 2020 Edition Contributor(s): Baldi, Antonio (Editor), Kramer, Sharlotte L. B. (Editor), Pierron, Fabrice (Editor) |
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ISBN: 3030301001 ISBN-13: 9783030301002 Publisher: Springer OUR PRICE: $161.49 Product Type: Paperback - Other Formats Published: August 2021 |
Additional Information |
BISAC Categories: - Science | Mechanics - Solids - Technology & Engineering | Engineering (general) - Technology & Engineering | Materials Science - General |
Dewey: 531 |
Physical Information: 0.38" H x 8.25" W x 11" (0.92 lbs) 169 pages |
Descriptions, Reviews, Etc. |
Publisher Description: Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6 of the Proceedings of the 2019 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the sixth volume of six from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including: Test Design and Inverse Method Algorithms Inverse Problems: Virtual Fields Method Residual Stresses: Measurement, Uncertainty & Validation Residual Stresses: Eigenvalues, Modeling, & Crack Growth Material Characterizations Using Thermography Fatigue, Damage & Fracture Evaluation Using Infrared Thermography
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