| Interconnect Reliability in Advanced Memory Device Packaging 2023 Edition Contributor(s): Gan (Author), Huang (Author) |
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ISBN: 3031267079 ISBN-13: 9783031267079 Publisher: Springer OUR PRICE: $208.99 Product Type: Hardcover Published: April 2023 |
| Additional Information |
| BISAC Categories: - Computers | Hardware - General - Technology & Engineering | Electronics - Circuits - General |
| Physical Information: 0.71" H x 6.3" W x 9.37" (1.30 lbs) 210 pages |