Limit this search to....

Interconnect Reliability in Advanced Memory Device Packaging 2023 Edition
Contributor(s): Gan (Author), Huang (Author)
ISBN: 3031267109     ISBN-13: 9783031267109
Publisher: Springer
OUR PRICE:   $208.99  
Product Type: Paperback
Published: May 2023
Qty:
Temporarily out of stock - Will ship within 2 to 5 weeks
Additional Information
BISAC Categories:
- Computers | Hardware - General
- Technology & Engineering | Electronics - Circuits - General
Physical Information: 210 pages