Interconnect Reliability in Advanced Memory Device Packaging 2023 Edition Contributor(s): Gan (Author), Huang (Author) |
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ISBN: 3031267109 ISBN-13: 9783031267109 Publisher: Springer OUR PRICE: $208.99 Product Type: Paperback Published: May 2023 |
Additional Information |
BISAC Categories: - Computers | Hardware - General - Technology & Engineering | Electronics - Circuits - General |
Physical Information: 210 pages |