| Thermal Contact Conductance 2014 Edition Contributor(s): Madhusudana, Chakravarti V. (Author) |
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ISBN: 3319012754 ISBN-13: 9783319012759 Publisher: Springer OUR PRICE: $104.49 Product Type: Hardcover - Other Formats Published: October 2013 |
| Additional Information |
| BISAC Categories: - Science | Mechanics - Thermodynamics - Technology & Engineering | Mechanical |
| Dewey: 621.402 |
| Series: Mechanical Engineering |
| Physical Information: 0.8" H x 6" W x 9.2" (1.10 lbs) 260 pages |
| Descriptions, Reviews, Etc. |
| Publisher Description: The work covers both theoretical and practical aspects of thermal contact conductance. The theoretical discussion focuses on heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data that can be used in designing heat-transfer equipment for a variety of joints, including special geometries and configurations. All of the material has been updated to reflect the latest advances in the field. |
