| RF and Microwave Microelectronics Packaging II Softcover Repri Edition Contributor(s): Kuang, Ken (Editor), Sturdivant, Rick (Editor) |
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ISBN: 3319847198 ISBN-13: 9783319847191 Publisher: Springer OUR PRICE: $94.99 Product Type: Paperback - Other Formats Published: June 2018 |
| Additional Information |
| BISAC Categories: - Technology & Engineering | Electronics - Microelectronics - Technology & Engineering | Microwaves - Technology & Engineering | Telecommunications |
| Dewey: 621.381 |
| Physical Information: 0.4" H x 6.14" W x 9.21" (0.60 lbs) 172 pages |
| Descriptions, Reviews, Etc. |
| Publisher Description: This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to "RF and Microwave Microelectronics Packaging" (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics. |
