Testing of Interposer-Based 2.5d Integrated Circuits Softcover Repri Edition Contributor(s): Wang, Ran (Author), Chakrabarty, Krishnendu (Author) |
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ISBN: 3319854615 ISBN-13: 9783319854618 Publisher: Springer OUR PRICE: $113.99 Product Type: Paperback - Other Formats Published: May 2018 |
Additional Information |
BISAC Categories: - Technology & Engineering | Electronics - Circuits - General - Computers | Systems Architecture - General - Computers | Logic Design |
Dewey: 004.1 |
Physical Information: 0.42" H x 6.14" W x 9.21" (0.63 lbs) 182 pages |
Descriptions, Reviews, Etc. |
Publisher Description: This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable. |