| Electronic Packaging for High Reliability, Low Cost Electronics Contributor(s): Tummala, R. R. (Editor), Kosec, Marija (Editor), Jones, W. K. (Editor) |
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ISBN: 904815085X ISBN-13: 9789048150854 Publisher: Springer OUR PRICE: $161.49 Product Type: Paperback - Other Formats Published: December 2010 |
| Additional Information |
| BISAC Categories: - Technology & Engineering | Electronics - General - Technology & Engineering | Optics - Technology & Engineering | Materials Science - Electronic Materials |
| Dewey: 621.381 |
| Series: NATO Science Partnership Sub-Series: 3: |
| Physical Information: 296 pages |
| Descriptions, Reviews, Etc. |
| Publisher Description: Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies. |