| Embedded Dielectrics for Electronic Packaging Contributor(s): Wong, Ching-Ping (Author), Sun, Rong (Author), Yu, Shuhui (Author) |
|
 |
ISBN: 9814619418 ISBN-13: 9789814619417 Publisher: World Scientific Publishing Company OUR PRICE: $131.10 Product Type: Hardcover Published: May 2025 This item may be ordered no more than 25 days prior to its publication date of May 31, 2025 |
| Additional Information |
| BISAC Categories: - Technology & Engineering | Nanotechnology & Mems - Technology & Engineering | Electronics - Circuits - Integrated - Technology & Engineering | Industrial Design - Packaging |
| Series: Wspc Advanced Integration and Packaging |
| Physical Information: 300 pages |
| Descriptions, Reviews, Etc. |
| Publisher Description: This book provides an overview of nanocomposite materials that can be used as embedded dielectric layer in high-density electronic packaging, for decoupling, filtering, energy storage or electrostatic discharge suppressing, etc. Some fundamental models used to analyze or predict the dielectric behavior of ceramic/polymer, conductor/polymer, and semiconductor/polymer composites are reviewed. This book also introduces design and synthesis of some novel hybrid filler particles, as well as graft modification on the polymer matrix to improve dielectric performance. |