| Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interfa Softcover Repri Edition Contributor(s): Seok, Seonho (Author) |
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ISBN: 3030085619 ISBN-13: 9783030085612 Publisher: Springer OUR PRICE: $151.99 Product Type: Paperback - Other Formats Published: January 2019 |
| Additional Information |
| BISAC Categories: - Technology & Engineering | Manufacturing - Technology & Engineering | Nanotechnology & Mems - Technology & Engineering | Materials Science - Thin Films, Surfaces & Interfaces |
| Dewey: 620.11 |
| Series: Springer Advanced Manufacturing |
| Physical Information: 0.26" H x 6.14" W x 9.21" (0.41 lbs) 115 pages |