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Title Author / Artist Prod Type ISBN/ISBN-13
or UPC		 Pub
Date		 Price
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interfa Softcover Repri Edition (Springer Advanced Manufacturing)Seok, SeonhoPaperback3030085619 /
9783030085612		01/2019$151.99
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interfa 2018 Edition (Springer Advanced Manufacturing)Seok, SeonhoHardcover3319778714 /
9783319778716		05/2018$151.99
  (2 items found)