| Advanced Metallization Conference 2005 (AMC 2005): Volume 21 Contributor(s): Brongersma, Sywert H. (Editor), Taylor, Thomas C. (Editor), Tsujimura, Manabu (Editor) |
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ISBN: 1558998659 ISBN-13: 9781558998650 Publisher: Materials Research Society OUR PRICE: $29.44 Product Type: Hardcover Published: January 2006 |
| Additional Information |
| BISAC Categories: - Technology & Engineering | Metallurgy - Technology & Engineering | Materials Science - General |
| Series: Material Research Society Conference Proceedings |
| Physical Information: 1.7" H x 6.4" W x 9.3" (2.55 lbs) 755 pages |
| Descriptions, Reviews, Etc. |
| Publisher Description: Technical leaders from around the world gather here to discuss developments in the areas of interconnect performance, advanced metallization, low-dielectric constant materials, barrier metallization, atomic layer deposition, advanced packaging and vertical integration. Both current state-of-the-art and ongoing challenges associated with multilevel interconnect are addressed. Included are papers on the latest developments in the integration of low-dielectric constant materials with copper-based metallization, and advances in the understanding of means by which process- or stress-induced damage can be mitigated and reliability of the interconnect system improved. Additional contributions discuss the design, development and modeling of advanced on-chip and multichip interconnect architectures and real-world implementation of optimized designs, materials and processes for production of leading-edge microelectronic devices. |